条带劈刀
Heavy wire bonding is used for think packages with a wire thickness of up to 500 µm for high currents, e.g. in power modules, and multiple wires and stitch bonds.
Ribbon bonding is a common choice for high volume, low cost bonding, and provides better productivity, better performance, and reliability.
MPP offers a complete line of standard Heavy Ribbon tools up to 80x10 [mil] ribbon size.
MPP’s Heavy Ribbon Wedges are manufactured using high quality Tungsten Carbide material.
性能
HWW Ribbon
Heavy Ribbon Tool
| P/N | Diamond size [mils] | Pitch [mils] | FL [mils] | W [mils] | GW [mils] | GD [mils] |
| HR025-060-105-450-UAC-W00 | 2.5 | 6 | 10.5 | 45 | 3.5 | 1.8 |
| HR040-100-150-900-UAC-W00 | 4 | 10 | 15 | 90 | 6 | 3 |
| HR050-100-340-750-UAC-W00 | 5 | 10 | 34 | 75 | 4.8 | 4 |
下载
相关文件
HWW.pdf
相关文件
