超细间距（UFP）©劈刀的应用
This model is a Patent of MPP for Thicker Wire. MPP has developed an advanced solution for thicker wire bonding - 35 um pitch with 20 um wire.
性能
应用
Wedge for Ultra Fine Pitch Applications UFP®- 4WU Model
| Suggested Wire | HD BL | FR | BR | Width | VSR Width | S (Throat Size) |
| inches / µm | inches / µm |
inches / µm |
W inches / µm |
VSR W inches / µm |
S inches / µm |
|
| .0007 - .0008 18-20 µm |
1520 | .0008 20 |
.0003 8 |
.0022 55 |
.0025 63 |
.0110 280 |
** This Wedge Design has under patent no. 61/755,464.*The dimensions in the table are for reference oly. For suitable P/N for your application, please contact your local representative.
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FWW.pdf
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